Fiber Output Enables Simple System Integration Semiconductor Laser Welding Machine
| Laser Head Structure: | T / F/ Y 36 Series | Model: | HW-D |
| Laser Power: | 200W - 1000W | Wavelength: | 915nm ±5 |
| Connection: | SMA905 / QBH | Cooling method: | Air/Water Cooling |
| Cooling mode: | CW / QCW / PWM With Timing Control | Fiber core(um): | 100/200 Um |
| Laser Source Size: | 525*430*225 Mm | ||
| High Light: | semiconductor laser welding machine,fiber output laser welder,aluminium laser welding system |
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Laser-based joining eliminates direct contact between the processing tool and the workpiece. There is no welding electrode pressing against the component during operation, which helps reduce mechanical marks and tool-related contamination. For electronic assemblies and small industrial parts, this non-contact approach can simplify the joining process while keeping the working area more accessible.
The laser can deliver heat to a defined processing zone instead of heating the entire component. This characteristic is useful when neighboring parts must remain relatively unaffected during joining. By adjusting the laser output and processing conditions, manufacturers can develop localized heating processes for connectors, sensors, electronic components, plastic assemblies and other small-scale products.
- Non-Contact Processing for Cleaner Production.
- Localized Energy Delivery for Selective Joining.
- Fiber Output Enables Simple System Integration.
- A Reliable Solution for Contemporary Manufacturing.
| Model | HW-D |
|---|---|
| Laser Power | 200W - 1000W |
| Wavelength | 915nm ±5 |
| Fiber core(um) | 100/200 um |
| Connection | SMA905 / QBH |
| Working Mode | CW / QCW / PWM with timing control |
This laser source supports SMA905 or QBH connectors, paired with 100 μm and 200 μm fiber core options to accommodate diverse beam transmission demands. Its separate design for laser source and working zone facilitates system integration with positioning stages, robot units or custom production jigs. This setup is highly suitable for manufacturers building tailor-made automatic welding workstations.
The semiconductor laser welder adapts to workflows requiring precise non-contact thermal treatment. Common use cases cover plastic part bonding, electronic soldering and thin metal sheet machining. Diode lasers have gained solid adoption in plastic welding and laser soldering applications. Their targeted heat input safeguards adjacent components and ensures consistent production results.
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