HanWei Uniform Beam Energy Distribution Semiconductor Laser Welding Machine
| Laser Head Structure: | T / F/ Y 36 Series | Model: | HW-D |
| Laser Power: | 200W - 1000W | Wavelength: | 915nm ±5 |
| Connection: | SMA905 / QBH | Cooling method: | Air/Water Cooling |
| Cooling mode: | CW / QCW / PWM With Timing Control | Fiber core(um): | 100/200 Um |
| Laser Source Size: | 525*430*225 Mm | ||
| High Light: | uniform beam laser welding machine,semiconductor laser welding machine,aluminium laser welding machine with warranty |
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The semiconductor laser welding machine uses a fiber-coupled semiconductor laser source to deliver laser energy directly to the processing area. Compared with conventional YAG laser technology, semiconductor laser sources offer higher electro-optical conversion efficiency, helping reduce energy consumption during operation.
Designed with a compact structure, the semiconductor laser welding machine requires less installation space than many conventional welding systems. Its compact configuration makes it easier to arrange around existing production equipment and integrate into different manufacturing environments. The machine is also equipped with Hanwei’s independently developed laser source control system, providing the foundation for stable laser output and helping maintain a competitive equipment cost.
- Uniform beam energy distribution.
- Space-Saving Configuration for Flexible Integration.
- Broad and Even Light Distribution.
- Suitable for Sensitive and Thin Materials.
| Model | HW-D |
|---|---|
| Laser Power | 200W - 1000W |
| Wavelength | 915nm ±5 |
| Fiber core(um) | 100/200 um |
| Connection | SMA905 / QBH |
| Working Mode | CW / QCW / PWM with timing control |
A key characteristic of semiconductor laser welding is its relatively large laser spot. The emitted beam provides a more evenly distributed energy profile across the working area rather than concentrating the energy into an extremely small point. This makes the system suitable for applications requiring controlled surface heating and helps provide a more consistent thermal effect across the welding zone.
The semiconductor laser welding machine is particularly suitable for processes that require moderate and well-distributed heat input. Typical applications include plastic laser welding, tin soldering, and welding of thin sheet metals. It can be considered for manufacturing processes involving electronic components, small metal parts, plastic assemblies, and other products where localized heating and controlled energy delivery are required. Before production use, welding parameters should be selected according to the specific material, thickness, joint structure, and required result.
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