A Flexible Component for Laser Equipment Builders Semiconductor Laser Welding Head
| Interface type: | QBH - QBH | Collimating length: | Diode 110 – Fiber 100/120/150 |
| Usable laser source: | Diode And Fiber Laser Source | Laser Power: | Diode Laser ≤ 30000 W & Fiber Laser ≤ 4000 W |
| Accessible wave range: | 915nm + 1064nm | Net Weight: | 2.5 Kg |
| Focuses length: | 200 | Head Type: | Y |
| Model: | HW-BFH-XXXXXX | ||
| High Light: | flexible semiconductor laser welding head,fiber laser welding head component,laser equipment welding head |
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This semiconductor laser welding head is developed for welding systems that use semiconductor laser sources. Its working range covers applications where controlled laser energy is required for joining different types of materials. The head can be used as part of equipment for plate welding, component assembly, soldering processes, and plastic welding.
The welding head combines a practical configuration with an economical equipment concept. It can be incorporated into production systems where the welding head needs to work with different semiconductor laser power levels. This makes it applicable to both relatively small welding tasks and processes involving larger workpieces or thicker materials.
Key Features
- Built Around Semiconductor Laser Applications.
- A Practical Choice for Different Production Tasks.
- Three Fiber Connection Choices.
- From 30W to 4000W.
- Water Circuit Within the Head.
- Enclosed Internal Construction.
- A Flexible Component for Laser Equipment Builders.
| Model |
HW-36-XXXXXX-T-QBH |
HW-50-XXXXXX-F-QBH |
|---|---|---|
| Usable Power |
200 W maximum |
500-4000 W maximum |
|
Collimating length |
80/100/120/150/200 |
100 / 150 / Customized |
|
Focus length |
80/100/120/150/200 |
80/100/120/150/200 |
| Interface type |
SMA 905 / D80 |
SMA 905 / QBH |
| Accessible wave range | 1064 | 1064 |
| Head Type |
F / T / Y |
F / T / Y |
| Net Weight |
1.1 kg |
2.7 kg |
|
Usable laser source |
Diode laser source |
Diode laser source |
The power range extends from 30W to 4000W, covering a broad selection of semiconductor laser applications. Lower-power configurations can be used where a smaller laser output is required, while higher-power versions can be matched with applications involving greater welding requirements. The actual welding result depends on the material, thickness, joint design, laser parameters, and process conditions.
Water cooling is incorporated into the welding head structure. A built-in water circuit allows the head to be used with a water-cooling system when required by the selected configuration. This configuration is intended for laser welding equipment working with semiconductor laser sources across its specified power range.
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