HW Water‑Cooling Path Built into the Structure Semiconductor Laser Welding Head
الخصائص الأساسية
مكان المنشأ:
شنتشن، الصين
الاسم التجاري:
HanWei
الشهادة:
CE
رقم الطراز:
HW-BFH-XXXXXX
تداول العقارات
الحد الأدنى لكمية الطلب:
1 مجموعة
السعر:
USD / Set
شروط الدفع:
تي/تي
القدرة على التوريد:
2000 مجموعة / سنة
تحديد
| Interface type: | QBH - QBH | Collimating length: | الصمام الثنائي 110 - الألياف 100/120/150 |
| Usable laser source: | مصدر ليزر الصمام الثنائي والألياف | Laser Power: | ليزر الصمام الثنائي ≤ 30000 W & Fiber Laser ≤ 4000 W |
| Accessible wave range: | 915nm + 1064nm | Net Weight: | 2.5 كجم |
| Focuses length: | 200 | Head Type: | ي |
| Model: | HW-BFH-XXXXXX | ||
| High Light: | water-cooled semiconductor laser welding head,fiber laser welding head with cooling,structured semiconductor laser welding head |
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وصف المنتج
HW Water‑Cooling Path Built into the Structure Semiconductor Laser Welding Head Designed as a matching component for semiconductor laser sources, this welding head can be used across several joining processes. Its applications include medium-thickness plate welding, welding of large products, soldering, and plastic welding. This makes it a practical choice for production tasks involving different types of workpieces and joining requirements. The product is developed around