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Semiconductor Laser Welding Machine: A Practical Solution for Modern Manufacturing

Basic Properties
Place of Origin: Shenzhen, China
Brand Name: HanWei
Certification: CE
Model Number: HW-D
Trading Properties
Minimum Order Quantity: 1 Set
Price: USD / Set
Payment Terms: T/T
Supply Ability: 2000 Sets / year
Specifications
Laser Head Structure: T / F/ Y 36 Series Model: HW-D
Laser Power: 200W - 1000W Wavelength: 915nm ±5
Connection: SMA905 / QBH Cooling method: Air/Water Cooling
Cooling mode: CW / QCW / PWM With Timing Control Fiber core(um): 100/200 Um
Laser Source Size: 525*430*225 Mm
High Light:

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Product Description
Semiconductor Laser Welding Machine: A Practical Solution for Modern Manufacturing

The semiconductor laser welding machine uses a fiber-coupled diode laser as its processing source. Unlike laser systems that rely on an additional gain medium, direct diode technology delivers the laser energy generated by semiconductor emitters directly into the optical delivery path. This architecture provides a practical solution for applications requiring controlled and localized thermal processing.

The laser source supports CW, QCW and PWM operating modes with timing control, allowing users to select different output characteristics according to the material and joining process. Continuous output can be used for steady heating, while pulsed operation provides greater flexibility when working with small components or heat-sensitive assemblies. This makes the system suitable for both continuous production and customized process development.

HW Diode Laser Welding Machine
Key Features
  • Direct Diode Laser Technology for Targeted Processing.
  • Flexible Operating Modes for Different Processes.
  • Fiber Delivery for Convenient System Integration.
  • A Practical Solution for Modern Manufacturing.
Technical Specifications
Model HW-D
Laser Power 200W - 1000W
Wavelength 915nm ±5
Fiber core(um) 100/200 um
Connection SMA905 / QBH
Working Mode CW / QCW / PWM with timing control
Primary Applications

With SMA905 or QBH connection options and 100 μm or 200 μm fiber cores, the laser source can be configured for different beam-delivery requirements. The separated laser source and processing area also make it easier to integrate the system with positioning platforms, robotic equipment or dedicated production fixtures. This configuration is particularly useful for manufacturers developing customized automated welding stations.

The semiconductor laser welding machine can be incorporated into processes where controlled, contact-free heating is required. Typical applications include plastic component joining, electronic soldering and thin-sheet metal processing. Diode lasers are particularly well established in plastic welding and laser soldering, where localized heat delivery can help protect surrounding components and support repeatable production.